Technical Applications Slitting & Sheeting
Custom-engineered for demanding technical substrates where material integrity and micro-precision are non-negotiable.
We provide customers with one-to-one customized solutions for the environmental packaging industry.
Good service, supervision and production process are only for our customers to smile with satisfaction.
We have customer service department, inline service department and spare part service department, over 50+ workers.
The non-contact winding design eliminates roller friction, while ionized nitrogen purge at the slit point maintains ISO Class 5 cleanliness. Blade vibration is held below 0.5µm RMS—preventing particle embedding or micro-scratches on sensitive surfaces.
Yes. Programmable parameters (blade speed, clearance, tension profiles) are stored per material ID. Changeovers auto-load settings in <2 minutes, and real-time laser edge monitoring adjusts tension dynamically—ensuring ±0.1mm precision across 100x thickness ranges.
Ultrasonic-assisted slitting uses high-frequency blade vibration to sever fibers cleanly without crushing. Combined with customized blade geometries (e.g., 15° bevel for aramids), this preserves >95% of tensile strength—critical for aerospace or medical device precursors.
The system supports batches as short as 10m with zero setup waste. Auto-thread technology reduces leader/trailer to <0.5m, and tension stabilization occurs within 3 revolutions—making 20m R&D runs cost-effective versus conventional slitters requiring 50m+ for stability.
Active vision feedback (laser triangulation) measures slit width at 1kHz, adjusting blade position via voice-coil actuators in real-time. This maintains edge placement accuracy to ±3µm (3σ) over 100m runs—meeting semiconductor-grade tolerances for biochip or display manufacturing.
